- Characteristics :
Core Features and Advantages
High-Quality Shielding Effectiveness: Provides extreme shielding power of 80dB-100dB within the 10MHz-1GHz frequency band, far exceeding the industry average, ensuring sensitive components operate in a zero-interference environment.
Excellent Electrochemical Stability: Passes rigorous testing under ASTM B117-03 standards (5% salt spray, 48 hours, and 35°C), maintaining a resistance value of <0.0602/sq, demonstrating exceptional corrosion resistance.
Precision Physical Construction: An ultra-high fabric density of 230T ± 10 and precise thickness control of 0.12mm ensure extremely high dimensional stability of the substrate during die-cutting.
High-Grade Adhesion: Metal layer adhesion reaches AATCC level 4 or higher, effectively preventing short-circuit risks caused by conductive powder shedding (dust shedding) during friction, peeling, or long-term use.
- Application:
Consumer Electronics Shielding and Grounding: Widely used in the internal design of smartphones, laptops, and tablets, providing a zero-interference EMI (electromagnetic interference) shielding environment for high-frequency sensitive components such as CPUs and GPUs.
Medical Equipment Precision Protection: Due to its excellent electrochemical stability, it is suitable for wrapping signal transmission lines in medical diagnostic equipment such as MRI and precision ultrasound, ensuring the purity and stability of medical signals.
Communication Base Stations and Networking Equipment: Provides extreme shielding effectiveness in the 10MHz – 1GHz frequency band, effectively solving crosstalk problems between modules within base stations and preventing signal leakage.
New Energy Vehicle Electronic Control Systems: With its high-level bonding strength (preventing powder shedding) and salt spray resistance, it can be safely used for electromagnetic sealing of battery management systems (BMS) and vehicle radar, avoiding the risk of short circuits caused by powder shedding.Flexible Printed Circuit (FPC) Reinforcement: Utilizing its precise 0.12mm thickness, it provides reliable grounding conductivity and physical dimensional support for flexible circuits without increasing volume excessively.
- Product Features:
- Parameters :
